Data Center RDIMM DDR4 Tester
An experimental platform for development of RAM controllers supporting RDIMM DDR4 RAM modules commonly used in data centers, built around the Xilinx Kintex-7 FPGA.
This hardware platform is used in Antmicro's and Google's Rowhammer testing framework which can be used to perform (and potentially mitigate) Rowhammer-type attacks on DRAM memories. You can learn more about Rowhammer and our work towards mitigating it in a Google Open Source blog note describing a related platform.
You can read more about this board in this Antmicro blog note.
Kintex-7 XC7K160T-FFG676 FPGA
TE 2199155-1 DDR4 RDIMM connector with hotswap
HDMI output interface exposed on Amphenol 685119134923 connector
1GbE interface implemented with Microchip KSZ9031RNXCA triple-speed Ethernet PHY transceiver chip and integrated magnetics Würth Elektronik 7499111121A RJ45 connector
USB-C debug connector with FT4232HQ FTDI USB controller
JTAG interface exposed on Molex 878321412 connector
Würth Elektronik 693071020811 microSD card slot
16 MBytes Cypress Semiconductor S25FL128SAGNFI000 QSPI FLASH memory
Cypress Semiconductor S27KL0641DABHI023
External 7-12V DC power input
Power Over Ethernet interface implemented with Texas Instruments TPS2372-3RGWR power delivery chip and CUI PDQE30-Q48-S12-D isolated DC/DC converter
Power consumption monitoring using (Microchip PAC1954T-E/4MX)
5 user LEDs
Optional Samtec ASP-134486-01 FMC HPC expansion connector
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Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.01 | ||
F.Cu | copper | 0.035 | ||
dielectric 1 | prepreg | 1080(69%)+106(74%)S1000-2MB | 0.074 | 3.9 |
In1.Cu | copper | 0.035 | ||
dielectric 2 | prepreg | 1080(69%)+106(74%)S1000-2MB | 0.112 | 3.9 |
In2.Cu | copper | 0.035 | ||
dielectric 3 | prepreg | 1080(69%)+106(74%)S1000-2MB | 0.126 | 3.9 |
In3.Cu | copper | 0.035 | ||
dielectric 4 | prepreg | 1080(69%)+106(74%)S1000-2MB | 0.126 | 3.9 |
In4.Cu | copper | 0.035 | ||
dielectric 5 | core | S1000-2M | 0.13 | 4.9 |
In5.Cu | copper | 0.035 | ||
dielectric 6 | prepreg | 1080(69%)+106(74%)S1000-2MB | 0.106 | 3.9 |
In6.Cu | copper | 0.035 | ||
dielectric 7 | prepreg | S1000-2M | 0.2 | 4.9 |
In7.Cu | copper | 0.035 | ||
dielectric 8 | core | 106(74%)+1080(69%)S1000-2MB | 0.114 | 3.9 |
In8.Cu | copper | 0.035 | ||
dielectric 9 | prepreg | 106(74%)+1080(69%)S1000-2MB | 0.1263 | 3.9 |
In9.Cu | copper | 0.035 | ||
dielectric 10 | core | 106(74%)+1080(69%)S1000-2MB | 0.112 | 3.9 |
In10.Cu | copper | 0.035 | ||
dielectric 11 | prepreg | 106(74%)+1080(69%)S1000-2MB | 0.074 | 3.9 |
B.Cu | copper | 0.035 | ||
B.Mask | Bottom Solder Mask | 0.01 |
