Myra SiP Interposer

Compact system on chip inteposer, designed to replace MCU, FRAM and USB to UART converter with single chip. Features STM32G491REI6 MCU, 128kB FRAM, FTDI FT231XQ USB to UART converter.

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Manufacturer	Manufacturer part number	Description
FTDI Chip	FT231XQ-R	USB Interface, USB-UART Converter, USB 2.0, 2.97 V, 5.5 V, SSOP, 20 Pins
Fujitsu	MB85RS1MTPW-G-APEWE1	1Mbit FRAM (Ferroelectric RAM) Memory; SPI 30 MHz; WLP-8 2.3x3.1mm
Onsemi	NCP177AMX330TCG	LDO Fixed; 3V3; VIN<5.5V; 500mA; XDFN4-1x1mm
STMicroelectronics	STM32G491REI6	ARM MCU, STM32 Family STM32G4 Series Microcontrollers, ARM Cortex-M4F, 32 bit, 170 MHz, 512 KB
Antmicro	MYRA-231F1F08	Antmicro MYRA SiP
ECS Inc. International	ECS-.327-12.5-1210-TR	Crystal, 32.768 kHz, SMT, 1.2mm x 1.0mm, 12.5 pF, 20 ppm, ECX-1210
ECS Inc. International	ECS-1612MV-080-CN-TR	8 MHz XO (Standard) CMOS Oscillator 1.6V ~ 3.63V Standby 4-SMD, 25ppm; 1.6x1.2x0.6mm
YAGEO	CC0201KRX6S5BB104	SMD Multilayer Ceramic Capacitor, 0.1 µF, 6.3 V, 0201 [0603 Metric], ± 10%, X6S, CC Series
Murata	GRM033R61C105ME15D	SMD Multilayer Ceramic Capacitor, 1 uF, 16 V, 0201 [0603 Metric], ± 10%, X5R, GRM Series
Murata	GRM035R60J475ME15D	SMD Multilayer Ceramic Capacitor, 4.7 µF, 6.3 V, 0201 [0603 Metric], ± 20%, X5R, GRM Series
Murata	GJM0335C1E220JB01D	Multilayer Ceramic Capacitor MLCC - SMD/SMT, 22pF, 25VDC, 5%, 0201, C0G (NP0)
TDK	MPZ0603S800HT000	Ferrite Bead 0201 80ohms, 25%, DCR, 0.095ohms, 1200mA
Bourns	CR0201-FX-1001GLF	1 kOhms ±1% 0.05W, 1/20W, Chip Resistor 0402 (1005 Metric) Thick Film
Bourns	CR0201-FX-1003GLF	SMD Chip Resistor
YAGEO	RC0201FR-075K1L	SMD Chip Resistor

Name	Type	Material	Thickness[mm]	Constant
F.Mask	Top Solder Mask		0.01
F.Cu	copper		0.035
dielectric 1	prepreg	FR4	0.08	4.5
In1.Cu	copper		0.035
dielectric 2	core	FR4	0.08	4.5
In2.Cu	copper		0.035
dielectric 3	prepreg	FR4	0.08	4.5
B.Cu	copper		0.035
B.Mask	Bottom Solder Mask		0.01

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Myra SiP Interposer