SA800U (Snapdragon 845) Baseboard
The Snapdragon 845 Baseboard is a compact-sized (100x70mm/4x2.75 inch) carrier board for the Quectel SA800U-WF System on Module. The SA800U-WF features an octa-core Qualcomm Snapdragon 845 System on Chip based on the Kryo 385 64-bit CPU and the Adreno 630 GPU. The SoC also includes radio transceivers for dual-band (2.4GHz/5GHz) WiFi and Bluetooth 5.0, while the SoM includes on-board antenna ports which simplify the antenna integration process.
Quectel SA800U with Qualcomm Snapdragon 845
WiFi and Bluetooth
Gigabit Ethernet
Power over Ethernet controller
HDMI output implemented with on-board DSI-HDMI bridge
DSI interface exposed on Flexible Flat Cable (FFC) connector
USB 3.1 (Type-C) connector supporting host/otg mode with optional DisplayPort video output
USB 3.0 (Type-C) connector working in Downstream Facing (i.e. Host) Mode
M.2 connector (key M) for optional external storage
2x 4-lane MIPI CSI-2 camera interface
The board supports multiple power supply scenarios including: Power over Ethernet, USB-C PD (Power Delivery), External PSU or battery
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Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.01 | ||
F.Cu | copper | 0.035 | ||
dielectric 1 | core | FR4 | 0.274 | 4.5 |
In1.Cu | copper | 0.035 | ||
dielectric 2 | prepreg | FR4 | 0.274 | 4.5 |
In2.Cu | copper | 0.035 | ||
dielectric 3 | core | FR4 | 0.274 | 4.5 |
In3.Cu | copper | 0.035 | ||
dielectric 4 | prepreg | FR4 | 0.274 | 4.5 |
In4.Cu | copper | 0.035 | ||
dielectric 5 | core | FR4 | 0.274 | 4.5 |
B.Cu | copper | 0.035 | ||
B.Mask | Bottom Solder Mask | 0.01 |
