SC606T (Snapdragon 625) Baseboard
The Snapdragon 625 Baseboard is a compact-sized (100x80mm/4x3.1 inch) carrier board for the Quectel SC606T System on Module. The SC606T features an octa-core Qualcomm Snapdragon 625 System on Chip based on the ARM Cortex-A53 64-bit CPU and the Adreno 506 integrated GPU. The SoC also includes radio transceivers for dual-band (2.4GHz/5GHz) WiFi, Bluetooth 4.2 and LTE Cat 6 modem, while the SoM includes on-board antenna ports which simplify the antenna integration process.
Quectel SC606T Smart Module with Qualcomm Snapdragon 625
Dual-Band WiFi and Bluetooth
Cat 6 LTE modem with multi-constellation GNSS receiver
HDMI output implemented with on-board DSI-HDMI bridge
DSI interface exposed on Flexible Flat Cable (FFC) connector
USB 3.0 (Type-C) connector supporting host/otg mode
2x 4-lane MIPI CSI-2 camera interface
The board supports multiple power supply scenarios including: USB-C PD (Power Delivery), External PSU or battery
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Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.01 | ||
F.Cu | copper | 0.018 | ||
dielectric 1 | prepreg | FR4 | 0.12 | 4.2 |
In1.Cu | copper | 0.035 | ||
dielectric 2 | core | FR4 | 0.51 | 4.2 |
In2.Cu | copper | 0.035 | ||
dielectric 3 | prepreg | FR4 | 0.14 | 4.2 |
In3.Cu | copper | 0.035 | ||
dielectric 4 | core | FR4 | 0.51 | 4.2 |
In4.Cu | copper | 0.035 | ||
dielectric 5 | prepreg | FR4 | 0.12 | 4.2 |
B.Cu | copper | 0.018 | ||
B.Mask | Bottom Solder Mask | 0.01 |
