STM32H753 Renode Reference Platform
STM32H753 Renode Reference Platform board includes a high-performance 32-bit STM32H753 MCU and a group of sensors integrated into a development kit form factor. A digital twin of the board is represented in the Renode simulation framework, allowing users to experiment and learn how to integrate Renode into the development process.
Powered via USB-C
Dedicated debug/flashing USB-C port
100Mbit/s Ethernet
DRP USB-C
10-axis IMU
Power consumption meter
Temperature sensor
Light intensity sensor
2x CAN Bus terminal
1Gb QSPI Flash external memory
QWIIC expansion connector
HDMI passthrough
LED indicators
HDMI power
EDID Selectors (goldpins with jumpers / slide switches)
EDID EEPROM
USB-C Connector and on-board USB-to-I2C bridge
Power Mux
100 x 60 mm (3.94 x 2.36 inch) PCB outline
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Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.01 | ||
F.Cu | copper | 0.035 | ||
dielectric 1 | prepreg | FR4 | 0.12 | 4.5 |
In1.Cu | copper | 0.035 | ||
dielectric 2 | core | FR4 | 0.51 | 4.5 |
In2.Cu | copper | 0.035 | ||
dielectric 3 (1/2) | prepreg | FR4 | 0.07 | 4.5 |
dielectric 3 (2/2) | prepreg | FR4 | 0.07 | 4.5 |
In3.Cu | copper | 0.035 | ||
dielectric 4 | core | FR4 | 0.51 | 4.5 |
In4.Cu | copper | 0.035 | ||
dielectric 5 | prepreg | FR4 | 0.12 | 4.5 |
B.Cu | copper | 0.035 | ||
B.Mask | Bottom Solder Mask | 0.01 |
