STM32H753 Renode Reference Platform
The STM32H753 Renode Reference Platform pairs a real development kit with its digital twin in Renode, plus 40 hours hands-on support from the engineers who build Renode.
Adopt a simulation-based development flow with support from the Renode engineering team, valid for 12 months. We help your team run firmware in simulation, set up automated testing in CI, debug issues, and plan how to model your own designs.
The board is built around a high-performance 32-bit STM32H753 MCU, with a set of integrated sensors including 10-axis IMU (LSM6DSO accelerometer + gyroscope, IIS2MDC magnetometer, LPS25HB barometer), TMP108 temperature sensor and VEML7700 ambient light sensor.
Powered via USB-C
Dedicated debug/flashing USB-C port
100Mbit/s Ethernet
DRP USB-C
10-axis IMU (LSM6DSO accelerometer + gyroscope, IIS2MDC magnetometer, LPS25HB barometer)
Power consumption meter
TMP108 temperature sensor
VEML7700 ambient light sensor
2x CAN Bus terminal
1Gb QSPI Flash external memory
QWIIC expansion connector
100 x 60 mm (3.94 x 2.36 inch) PCB outline
Image | Manufacturer | Manufacturer part number | Description | Data available |
|---|---|---|---|---|
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
| ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
 | ||||
| ||||
 | ||||
| ||||
 | ||||
 | ||||
 | ||||
 | ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
 | ||||
 | ||||
 | ||||
 | ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
 | ||||
| ||||
| ||||
| ||||
| ||||
| ||||
 | ||||
 | ||||
 |
Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.01 | ||
F.Cu | copper | 0.035 | ||
dielectric 1 | prepreg | FR4 | 0.12 | 4.5 |
In1.Cu | copper | 0.035 | ||
dielectric 2 | core | FR4 | 0.51 | 4.5 |
In2.Cu | copper | 0.035 | ||
dielectric 3 (1/2) | prepreg | FR4 | 0.07 | 4.5 |
dielectric 3 (2/2) | prepreg | FR4 | 0.07 | 4.5 |
In3.Cu | copper | 0.035 | ||
dielectric 4 | core | FR4 | 0.51 | 4.5 |
In4.Cu | copper | 0.035 | ||
dielectric 5 | prepreg | FR4 | 0.12 | 4.5 |
B.Cu | copper | 0.035 | ||
B.Mask | Bottom Solder Mask | 0.01 |
