DC-SCM OSM-L Carrier Card
This board follows the interface and mechanical outline described in the 2.1 revision of the DC-SCM standard specified by the Open Compute Project community. It supports System on Modules following the OSM-L standard specified by the SGet group, and includes a series of breakout connectors, jumpers and other supplementary circuitry for developing BMC software features for security, reliability, commissioning and benchmarking.
Landing pad for OSM-L type of SoM
Realtek 1Gb Ethernet PHY (Realtek RTL8211FDI-CG)
ITE LVDS-DisplayPort bridge
USB-C port with FTDI FT4232 for SoM debug and software integration
USB-C port connected to the OSM-L SoM pads
USB-C port connected to the HPM
M.2 (key-M) expansion slot connected to the HPM
Slot for removable BIOS memories connected directly to the HPM
Optional on-board TPM connector
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Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.01 | ||
F.Cu | copper | 0.035 | ||
dielectric 1 | prepreg | PR2116 | 0.12 | 4.2 |
In1.Cu | copper | 0.018 | ||
dielectric 2 | core | FR4-Improved | 0.2 | 4.3 |
In2.Cu | copper | 0.018 | ||
dielectric 3 (1/2) | prepreg | PR1080 | 0.07 | 4.2 |
dielectric 3 (2/2) | prepreg | PR1080 | 0.07 | 4.2 |
In3.Cu | copper | 0.018 | ||
dielectric 4 | core | FR4-Improved | 0.2 | 4.3 |
In4.Cu | copper | 0.018 | ||
dielectric 5 (1/2) | prepreg | PR1080 | 0.07 | 4.2 |
dielectric 5 (2/2) | prepreg | PR1080 | 0.07 | 4.2 |
In5.Cu | copper | 0.018 | ||
dielectric 6 | core | FR4-Improved | 0.2 | 4.3 |
In6.Cu | copper | 0.018 | ||
dielectric 7 (1/2) | prepreg | PR1080 | 0.07 | 4.2 |
dielectric 7 (2/2) | prepreg | PR1080 | 0.07 | 4.2 |
In7.Cu | copper | 0.018 | ||
dielectric 8 | core | FR4-Improved | 0.2 | 4.2 |
In8.Cu | copper | 0.018 | ||
dielectric 9 | prepreg | PR2116 | 0.12 | 4.2 |
B.Cu | copper | 0.035 | ||
B.Mask | Bottom Solder Mask | 0.01 |