OSM-L BMC SoM
A System on Module (SoM) following the OSM-L standard specified by the SGet group. It integrates Lattice CertusPro-NX FPGA and NXP i.MX943 Application Processor (AP), along with local storage, clocking and power management circuitry.
Lattice CertusPro-NX LFCPNX-100-8CBG256C FPGA
NXP i.MX943 MIMX94398DVMMAA AP
8GB LPDDR4 (Micron MT53E2G32D4DE-046) memory connected to the AP
256MB NOR QSPI Flash memory (Micron MT35XU512ABA1G12-0AAT) shared by the AP and the FPGA
4 separate 128MB NOR QSPI Flash (Micron MT25QU01GBBB8E12-0SIT) memories accessible to the FPGA
NXP PPF9455AVSA4ES PMIC for power regulation and power sequencing
Texas Instruments TMP1075NDRLR on-board temperature sensor
Small mechanical outline (45x45mm)
Image | Manufacturer | Manufacturer part number | Description | Data available |
|---|---|---|---|---|
Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.015 | ||
F.Cu | copper | 0.035 | ||
dielectric 1 | prepreg | S1000-2M | 0.065 | 3.9 |
In1.Cu | copper | 0.018 | ||
dielectric 2 | prepreg | S1000-2M | 0.065 | 3.9 |
In2.Cu | copper | 0.018 | ||
dielectric 3 | prepreg | S1000-2M | 0.196 | 4.56 |
In3.Cu | copper | 0.03 | ||
dielectric 4 | core | S1000-2M | 0.254 | 4.6 |
In4.Cu | copper | 0.03 | ||
dielectric 5 | prepreg | S1000-2M | 0.15 | 4.14 |
In5.Cu | copper | 0.03 | ||
dielectric 6 | core | S1000-2M | 0.254 | 4.6 |
In6.Cu | copper | 0.03 | ||
dielectric 7 | prepreg | S1000-2M | 0.196 | 4.56 |
In7.Cu | copper | 0.018 | ||
dielectric 8 | prepreg | S1000-2M | 0.065 | 3.9 |
In8.Cu | copper | 0.018 | ||
dielectric 9 | prepreg | S1000-2M | 0.065 | 3.9 |
B.Cu | copper | 0.035 | ||
B.Mask | Bottom Solder Mask | 0.015 |
OSM-L BMC SoM
