OSM-L BMC SoM
A System on Module (SoM) following the OSM-L standard specified by the SGet group. It integrates Lattice CertusPro-NX FPGA and NXP i.MX943 Application Processor (AP), along with local storage, clocking and power management circuitry.
See on GitHub
KiCad Project (zip) 6.85 MB
Schematic PDF 4.83 MB
STEP model 5.64 MB
Lattice CertusPro-NX LFCPNX-100-8CBG256C FPGA
NXP i.MX943 MIMX94398DVMMAA AP
8GB LPDDR4 (Micron MT53E2G32D4DE-046) memory connected to the AP
256MB NOR QSPI Flash memory (Micron MT35XU512ABA1G12-0AAT) shared by the AP and the FPGA
4 separate 128MB NOR QSPI Flash (Micron MT25QU01GBBB8E12-0SIT) memories accessible to the FPGA
NXP PPF9455AVSA4ES PMIC for power regulation and power sequencing
Texas Instruments TMP1075NDRLR on-board temperature sensor
Small mechanical outline: 45 x 45 mm (1.77 x 1.77 inch)
Image | Manufacturer | Manufacturer part number | Description | Data available |
|---|---|---|---|---|
Name | Type | Material | Thickness[mm] | Constant |
|---|---|---|---|---|
F.Mask | Top Solder Mask | 0.015 | ||
F.Cu | copper | 0.035 | ||
dielectric 1 | prepreg | S1000-2M | 0.065 | 3.9 |
In1.Cu | copper | 0.018 | ||
dielectric 2 | prepreg | S1000-2M | 0.065 | 3.9 |
In2.Cu | copper | 0.018 | ||
dielectric 3 | prepreg | S1000-2M | 0.196 | 4.56 |
In3.Cu | copper | 0.03 | ||
dielectric 4 | core | S1000-2M | 0.254 | 4.6 |
In4.Cu | copper | 0.03 | ||
dielectric 5 | prepreg | S1000-2M | 0.15 | 4.14 |
In5.Cu | copper | 0.03 | ||
dielectric 6 | core | S1000-2M | 0.254 | 4.6 |
In6.Cu | copper | 0.03 | ||
dielectric 7 | prepreg | S1000-2M | 0.196 | 4.56 |
In7.Cu | copper | 0.018 | ||
dielectric 8 | prepreg | S1000-2M | 0.065 | 3.9 |
In8.Cu | copper | 0.018 | ||
dielectric 9 | prepreg | S1000-2M | 0.065 | 3.9 |
B.Cu | copper | 0.035 | ||
B.Mask | Bottom Solder Mask | 0.015 |
OSM-L BMC SoM
