DDR5 Testbed

This board targets a single DDR5 DRAM IC. It is compatible with the LPDDR4 Test Board and allows custom DRAM controller development and testing targeting single DDR5 ICs using the mature LPDDR4 test platform. The board is designed to target the Micron MT60B2G8HB-48B:A 16Gb DRAM. It can be connected to a test board to simulate Rowhammer attacks on the embedded memory module.

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Manufacturer	Manufacturer part number	Description
NXP Semiconductors	PCA6408APW	I/O Expander, 8 bit, I2C, SMBus, 1.65-5.5 V, TSSOP, 16 Pins
Microchip Technology	AT24CS01-ST	EEPROM Memory IC 1Kbit I²C 1 MHz 550 ns SOT-23-5
Micron Technology	MT60B2G8HB-48B:A	DRAM, SDRAM, 16 Gbit, 2G x 8bit, FBGA, 82 Pins
Texas Instruments	TPS613221ADBVT	Synchronous Boost Step Up Regulator, Fixed, 0.9V to 5.5V In, 3.3V/1.2A Out, 1.6MHz, SOT-23-5
Kingbright	KP-1608CGCK	LED, Green, SMD, 0603, 20 mA, 2.1 V, 570 nm
YAGEO	CC0201KRX6S5BB104	SMD Multilayer Ceramic Capacitor, 0.1 µF, 6.3 V, 0201 [0603 Metric], ± 10%, X6S, CC Series
Murata	GRM155R61A475MEAAD	SMD Multilayer Ceramic Capacitor, 4.7 µF, 10 V, 0402 [1005 Metric], ± 20%, X5R, GRM Series
Murata	GRM155R61H104KE14D	SMD Multilayer Ceramic Capacitor, 0.1 µF, 50 V, 0402 [1005 Metric], ± 10%, X5R, GRM Series
Würth Elektronik	742792022	Ferrite Bead, 0805 [2012 Metric], 220 ohm, 2 A, WE-CBF, 0.05 ohm, ± 25%, High Current
Murata	1285AS-H-2R2M=P2	Power Inductor (SMD), 2.2 µH, 1.2 A, Shielded, 1.5 A, DFE201610C
Bourns	CR0402-FX-1001GLF	SMD Chip Resistor, 1 kohm, ± 1%, 63 mW, 0402 [1005 Metric], Thick Film, General Purpose
Panasonic	ERJ2GE0R00X	SMD Chip Resistor, Jumper, 0 ohm, 100 mW, 0402 [1005 Metric], Thick Film, General Purpose
Bourns	CR0402-FX-1002GLF	SMD Chip Resistor, 10 kohm, ± 1%, 62.5 mW, 0402 [1005 Metric], Thick Film, General Purpose
Bourns	CR0402-FX-2400GLF	SMD Chip Resistor, 240 ohm, ± 1%, 63 mW, 0402 [1005 Metric], Thick Film, General Purpose
Bourns	CR0402-FX-2200GLF	SMD Chip Resistor, 220 ohm, ± 1%, 62.5 mW, 0402 [1005 Metric], Thick Film, General Purpose

Name	Type	Material	Thickness[mm]	Constant
F.Mask	Top Solder Mask		0.01
F.Cu	copper		0.018
dielectric 1	prepreg	FR4	0.11	4.3
In1.Cu	copper		0.018
dielectric 2	core	FR4	0.4	4.3
In2.Cu	copper		0.018
dielectric 3	prepreg	FR4	0.11	4.3
In3.Cu	copper		0.018
dielectric 4	core	FR4	0.4	4.3
In4.Cu	copper		0.018
dielectric 5	prepreg	FR4	0.11	4.3
B.Cu	copper		0.018
B.Mask	Bottom Solder Mask		0.01

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