LPDDR4 Testbed

An experimental breakout board for a single 200-ball WFBGA LPDDR4 chip in SO-DIMM DDR4 form factor. It’s one of the easily swappable testbeds for different memory types compatible with the LPDDR4 Test Board, which allows for easy, repeatable testing of multiple versions of the LPDDR4 IC with the same base platform. Please note that this board is not electrically compatible with off-the-shelf SO-DIMM DDR4 memory modules.

Manufacturer	Manufacturer part number	Description
NXP	PCA6408APW	I/O Expander, 8 bit, I2C, SMBus, 1.65-5.5 V, TSSOP, 16 Pins
Atmel	AT24CS01-ST	EEPROM Memory IC 1Kbit I²C 1 MHz 550 ns SOT-23-5
Micron Technology	MT53E1G32D2NP-046 WT:A	DRAM, Mobile LPDDR4, 32 Gbit, 1G x 32bit, 2.133 GHz, WFBGA, 200 Pins
Texas Instruments	TPS613221ADBVT	Synchronous Boost Step Up Regulator, Fixed, 0.9V to 5.5V In, 3.3V/1.2A Out, 1.6MHz, SOT-23-5
Kingbright	KP-1608CGCK	LED, Low Power, Green, SMT, 0603, 20 mA, 2.1 V, 570 nm
YAGEO	CC0201KRX6S5BB104	SMD Multilayer Ceramic Capacitor, 0.1 µF, 6.3 V, 0201 [0603 Metric], ± 10%, X6S, CC Series
Murata	GRM155R61A475MEAAD	SMD Multilayer Ceramic Capacitor, 4.7 µF, 10 V, 0402 [1005 Metric], ± 20%, X5R, GRM Series
Walsin	0402X104K6R3CT	SMT Multilayer Ceramic Capacitor, 0.1 µF, 6.3 V, 0402 [1005 Metric], ± 10%, X5R, Walsin MLCC
Murata	1285AS-H-2R2M=P2	Power Inductor (SMD), 2.2 µH, 1.2 A, Shielded, 1.5 A, DFE201610C
Panasonic	ERJ2GE0R00X	SMD Chip Resistor, Jumper, 0 ohm, 100 mW, 0402 [1005 Metric], Thick Film, General Purpose

Name	Type	Material	Thickness[mm]	Constant
F.Mask	Top Solder Mask		0.01
F.Cu	copper		0.035
dielectric 1	core	FR4	0.274	4.5
In1.Cu	copper		0.035
dielectric 2	prepreg	FR4	0.274	4.5
In2.Cu	copper		0.035
dielectric 3	core	FR4	0.274	4.5
In3.Cu	copper		0.035
dielectric 4	prepreg	FR4	0.274	4.5
In4.Cu	copper		0.035
dielectric 5	core	FR4	0.274	4.5
B.Cu	copper		0.035
B.Mask	Bottom Solder Mask		0.01

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LPDDR4 Testbed