OV9281 Dual camera board

Dual camera module equipped with a pair of 1-megapixel OmniVision OV9281 image sensors. The board includes mounting holes for standard S-Mount (M12) lens holders. Each image sensor can be connected to a host platform via a separate 2-lane MIPI CSI-2 interface.

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Manufacturer	Manufacturer part number	Description
OmniVision	OV9281	B&W CMOS 1 Megapixel (1280x800) Image Sensor with OmniPixel®3‑GS Technology
NXP Semiconductors	NTS0104BQ	Voltage Level Translator Bidirectional 1 Circuit 4 Channel 50Mbps 14-DHVQFN (2.5x3)
NXP Semiconductors	NTB0104BQ	Voltage Level Translator Bidirectional 1 Circuit 4 Channel 100Mbps 14-DHVQFN (2.5x3)
Texas Instruments	TLV73318PDBVT	Fixed LDO Voltage Regulator, 1.4V to 5.5V, 122mV Dropout, 1.8Vout, 300mAout, SOT-23-5
Texas Instruments	TLV73312PDBVT	Fixed LDO Voltage Regulator, 1.4V to 5.5V, 122mV Dropout, 1.2Vout, 300mAout, SOT-23-5
Texas Instruments	TLV73328PDBVT	Fixed LDO Voltage Regulator, 1.4V to 5.5V, 122mV Dropout, 2.8Vout, 300mAout, SOT-23-5
Würth Elektronik	68715014522	FFC connector
Onsemi	BSS138AKA	Power MOSFET, N Channel, 50 V, 220 mA, 6.0 ohm, SOT-23, Surface Mount
TXC	7C-24.000MBB-T	Oscillator, 24 MHz, 50 ppm, SMT, 5mm x 3.2mm, 3.3 V, 7C Series
Walsin	0805X475K250CT	SMD Multilayer Ceramic Capacitor, 4.7 µF, 25 V, 0805 [2012 Metric], ± 10%, X5R
Walsin	0402X104K6R3CT	SMT Multilayer Ceramic Capacitor, 0.1 µF, 6.3 V, 0402 [1005 Metric], ± 10%, X5R, Walsin MLCC
TDK	MLP2012S3R3MT	Multilayer Inductor, 3.3 µH, 0.19 ohm, 900 mA, 0805 [2012 Metric], MLP
Arducam	M27280M07S	Low Distortion 1/2.7″ 2.8 mm M12 Mount Lens
Bourns	CR0402-FX-1002GLF	SMD Chip Resistor, 10 kohm, ± 1%, 62.5 mW, 0402 [1005 Metric], Thick Film, General Purpose
Bourns	CR0402-FX-2001GLF	SMD Chip Resistor, 2 kohm, ± 1%, 62.5 mW, 0402 [1005 Metric], Thick Film, General Purpose
Panasonic	ERJ2GE0R00X	SMD Chip Resistor, Jumper, 0 ohm, 100 mW, 0402 [1005 Metric], Thick Film, General Purpose
Würth Elektronik	9774030243R	Spacer, SMT, Non Stop, Steel, Swage Round, 4.35 mm x 3 mm, M2 Thread, WA-SMSI Series

Name	Type	Material	Thickness[mm]	Constant
F.Mask	Top Solder Mask		0.01
F.Cu	copper		0.035
dielectric 1	prepreg	FR4	0.48	4.5
In1.Cu	copper		0.035
dielectric 2	prepreg	FR4	0.48	4.5
In2.Cu	copper		0.035
dielectric 3	core	FR4	0.48	4.5
B.Cu	copper		0.035
B.Mask	Bottom Solder Mask		0.01

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OV9281 Dual camera board